Aluminum Nitride AlN Metallized DBC Substrate/Plate/Disc with Au

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Aluminum Nitride AlN Metallized DBC Substrate/Plate/Disc with Au

Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper cladding method (DBC), etc.

Aluminum Nitride AlN Metallized DBC Substrate
1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm
2. Coating by Cu ,Mo/Mn,Ag, Plate with copper
3. Excellent thermal conductivity
4. High electrical insulation
Advantages of DBC ceramic substrate:
>high mechanical strength
>fine thermal conducticity
>excellent electrical isolation
>good adhesion
>corrosion resistant
>high reliability
>environmentally clean

Applications of DBC ceramic substrate:

1.power semiconductor modules
2.semiconductor refrig-erators
3.power control circuits
4.high frequency switch mode power suppliers
5.solid-state relays
6.Solar-panel arrays
7.telecommunications private branch exchange and receiving system industrial electronics
· AlN Ceramic Heat-sinks for high power system
· AlN Crucible for Metal Melting
· AlN Ceramic Rod
· AlN Ceramic Heater
· Ceramic Substrate
· Custom Shape

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