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Si3N4 DBC and AMB ceramic substrates

Si3N4 DBC and AMB ceramic substrates With the development of wide bandwidth semiconductors, power semiconductor devices to higher power density, higher chip temperature and higher reliability of the direction of development, and accordingly for the power semiconductor module packaging put forward higher requirements. Including our previous talk about no solder, no bonding wires and other interconnect technology trends, the choice of insulation substrate has also become a frequent topic of discussion. In order to improve the thermal performance of the module, [...]

Semiconductor Processes – Etching

Semiconductor Processes – Etching 1, etching process classification: There are two main types of etching processes in semiconductor manufacturing: dry etching and wet etching. Dry etching is divided into three: plasma etching, ion beam sputtering etching and reactive ion etching (RIE). Of course, etching can also be divided into graphic etching and graphic etching. Patterned etching using photoresist or other materials as a mask, only the bare part of the etching off, while no patterned etching is carried out in the [...]

Aluminium Nitride for semiconductor industry

Aluminium Nitride for semiconductor industry Aluminium nitride (AlN) with high strength, high volume resistivity, high insulation voltage, thermal expansion coefficient, and silicon match well, etc., not only used as structural ceramics sintering additives or reinforcing phase, especially in the field of ceramic electronic substrate and encapsulation materials in recent years, its performance is far more than alumina. Aluminium nitride materials in the field of electronics and electric power, locomotives, aviation and aerospace, national defence and military industry, communications and many industrial [...]

Bulletproof ceramic materials

Bulletproof ceramic materials 01The principle of Bulletproof with ceramic materials The basic principle of armor protection is to dissipate the energy of a projectile, slow it down and render it harmless. Whereas most conventional engineering materials, such as metals, absorb energy through plastic deformation of the structure, ceramics absorb energy through micro-fracturing processes.Bulletproof ceramic energy absorption process can be roughly divided into 3 stages: (1) initial impact stage: the projectile impact ceramic surface, so that the warhead blunt, in the ceramic surface [...]

PCB Ceramic circuit boards

PCB Ceramic circuit boards With the continuous upgrading and optimization of electronic products, the requirements of PCB, the carrier of its components, are also constantly improving, resulting in the emergence of ceramic circuit boards. So, what are the advantages of ceramic-based circuit boards over traditional glass fiber (FR-4) and aluminum-based and copper-based? FUBOON Explains for you: 1. The shape is warped and stable Ordinary PCB is usually made of copper foil and substrate, and most of the substrate materials are glass [...]

Ceramic ring for fiber laser cutting machine

Ceramic ring for fiber laser cutting machine The ceramic ring is an important part of the cutting head of the laser cutting machine. Its main function is to transmit the electrical signals collect by the laser head nozzle, which plays an important role in the normal and stable operation of the laser cutting machine. It is very important to choose a high-quality laser ceramic ring for the laser cutting machine. The laser ceramic ring compose of ceramic body, stainless steel parts, and copper [...]

Advanced ceramic components

Ceramic components  Many sintered body materials mainly composed of oxides are widely used in the production of electronic functional components. The manufacturing process of electronic ceramics is roughly the same as that of traditional ceramics. Electronic ceramics, or ceramics for the electronics industry, are fundamentally different from general ceramics for electric power in terms of chemical composition, microstructure and electromechanical properties. These differences are formed by a series of special technical requirements put forward by the electronics industry for electronic ceramics, [...]

Ceramic Lids for Hermetic Microelectronic Packages

Ceramic Lids for Hermetic Microelectronic Packages   Ceramic Lids for Non-magnetic Hermetic Microelectronic Packages Ceramic Lids are used primarily with Cerquad packages that require a glass or B-staged epoxy coated seal. Ceramic Lids FeaturesAvailable in a wide variety of shapes, sizes and thickness Low tempearture epoxy or glass seal Solid or window options Marking permanency