Aluminum Nitride Active Metal Brazed (AMB) Ceramic tructural Parts

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Aluminum Nitride Active Metal Brazed (AMB) Ceramic Substrate
Aluminum Nitride Active Metal Brazed (AMB) Ceramic Substrate 2

Aluminum Nitride Active Metal Brazed (AMB) Ceramic tructural Parts

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Aluminum Nitride Active Metal Brazed (AMB) Ceramic tructural Parts

AMB (Active Metal Brazing) is for joining ceramics that are not wetted by ‘conventional’ brazes.

By applying active metal like titanium to be added to the braze alloy, to achieve chemically reacts with the surface of the parent ceramic.Due to the coefficient of thermal expansion of Al2O3 (7.1 ppm/K), Si3N4 (2.6 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K), Direct Bond Copper (DBC) and AMB are suitable substrates for robust packaging of bare dice since such assemblies.
AMB is the promising thick film technology which can be applied to Power Electronics, Automotive Electronics, Home Appliances, Aerospace, Others.
INNOVACERA provide DBC, DPC, and AMB technology for customized ceramic substrates, welcome to consult more.
Aluminum Nitride Active Metal Brazed (AMB) Ceramic
Aluminium Nitride Material Properties
Properties
FUB-AN170
Color
Dark Gray
Main Content
96%ALN
Bulk Density(g/cm3)
3.335
Water Absorption
0.00
Flexural Strength(MPa)
382.70
Dielectric Constant(1MHz)
8.56
Coefficient Linear Thermal Expansion
/℃ ，5℃/min, 20-300℃
2.805*10-6
Thermal Conductivity
30 degree Celsius
>=170
Chemical Durability(mg/cm2)
0.97
Thermal Shocking Resistance
No cracks
Volume Resistivity(Ω .cm)
20 degree Celsius
1.4*1014
Dielectric Strength(KV/mm)
18.45
Surface roughness Ra(μm)
0.3-0.5
Camber(length ‰ )
<=2‰
Remark: The value is just for review, different using conditions will have a little difference.

Aluminum Nitride Active Metal Brazed (AMB) Ceramic

Application

– RF / Microwave Components

– Power Modulus
– Power Transformers
– High Power LED Package

– Laser Diode Sub-mounts

– LED Chip Sub-mount
– Microelectronic Packages
– Transistors

– High Thermal Conductivity Substrates for LED & Power Electronics

– Substrates for Power Electronics

– High Thermal Conductivity Substrates for LED & Power Electronics

– Substrates for Power Electronics

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