Fine polishing alumina nitride sheet
- Description
- Inquiry
Fine polishing alumina nitride sheet
Product Description
customized aluminium nitride heat dissipation ceramic substrate/ceramic sheet/ ceramic substrate for circuit board
Application: abrasion resistant lining patch; patch type electronic component substrate; computer accessories.
strong current, strong voltage, high temperature and easy wear parts of electronic appliances and mechanical equipment.
* High electrical insulation capacity (>1.1012Ωcm)
* Strength according to the double ring method >320 MPa (biaxial strength)
* Low thermal expansion 4 to 6×10-6K-1(between 20 and 1000°C)
* Good metalization capacity
strong current, strong voltage, high temperature and easy wear parts of electronic appliances and mechanical equipment.
Features
* Very high thermal conductivity (> 200 W/mK)
* High electrical insulation capacity (>1.1012Ωcm)
* Strength according to the double ring method >320 MPa (biaxial strength)
* Low thermal expansion 4 to 6×10-6K-1(between 20 and 1000°C)
* Good metalization capacity
Specification
Some common applications of Aluminum Nitride include the following:
Heat sinks & heat spreaders Electrical insulators for lasers Chucks, clamp rings for semiconductor processing equipment Electrical insulators Silicon wafer handling and processing Substrates& insulators for microelectronic devices & opto electronic devices Substrates for electronic packages Chip carriers for sensors and detectors Chip lets Col lets Laser heat management components Molten metal fixtures Packages for microwave devices.
Properties Sheet
Property | Unit | Alumina Nitride Ceramic |
Color | Grey | |
Mechanical Properties | ||
Density | g/cm3 | 3.31 |
Compressive Strength | MPa | 2100 |
Flexural Strength | MPa | 335 |
Vickers Hardness | GPa | 11 |
Thermal Properties | ||
Maximum Temperature | ||
Oxidizing | °C | 700 |
Inert | °C | 1300 |
Thermal Conductivity | 30 | |
@ 25°C | W/mK | 180 |
@ 300°C | W/mK | 130 |
Coefficient of Expansion | ||
CTE 25°C ➞ 100°C | 10^-6/°C | 3.6 |
CTE 25°C ➞ 300°C | 10^-6/°C | 4.6 |
CTE 25°C ➞ 500°C | 10^-6/°C | 5.2 |
CTE 25°C ➞ 1000°C | 10^-6/°C | 5.6 |
Specific Heat | 100°C | 750 |
Thermal Shock Resistance ΔT | °C | 400 |
Electrical Properties | ||
Dielectric Constant | 1 MHz | 8.6 |
Dielectric Strength | kV/mm | >15 |
Loss Tangent | 1 MHz | 5×10^-4 |
Fine polishing alumina nitride sheet
Alumina Nitride Applications
- Heat sinks & heat spreaders
- Electrical insulators for lasers
- Chucks, clamp rings for semiconductor processing equipment
- Electrical insulators
- Silicon wafer handling and processing
- Substrates & insulators for microelectronic devices & opto electronic devices
- Substrates for electronic packages
- Chip carriers for sensors and detectors
- Chiplets
- Collets
- Laser heat management components
- Molten metal fixtures
- Packages for microwave devices
Related Products
Aluminum nitride ceramic tube components for communications application
High temperature single crystal Aluminum Nitride Ceramic Crucibles
Aluminum Nitride Ceramic ALN Block Rod
High Thermal Conductivity Aluminum Nitride Ceramic substrate
High Thermal Conductivity Aluminum Nitride Ceramic Wafer
Aluminum Nitride Ceramic Heat Sinks
High Thermal Conductivity Alumina Nitride Ceramic Wafer Ring
Aluminum Nitride AlN Heat Sink
High Thermal Conductivity Aluminum Nitride Wafer Power Resistor Plate
AlN ceramic aluminum nitride part high thermal conductivity
AlN ceramic aluminum nitride part high thermal conductivity
High Thermal Conductivity Aluminum Nitride AlN Ceramic Substrate Plate
