Laser drilling Aluminum Nitride Ceramic AlN Plate Ceramic Sheet

Laser drilling Aluminum Nitride Ceramic AlN Plate Ceramic Sheet

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Laser drilling Aluminum Nitride Ceramic AlN Plate Ceramic Sheet

Aluminum Nitride is one of the few materials that offers electrical insulation and high thermal conductivity. This makes AlN extremely useful in high power electronic applications in heat sink and heat spreader applications.

Aluminum Nitride (AlN) is an excellent material to use if high thermal conductivity and electrical insulation properties are required. Because of it’s qualities, it is an ideal material for use in thermal management and electrical applications.
Some common applications of Aluminum Nitride include the following:
Heat sinks & heat spreaders Electrical insulators for lasers Chucks, clamp rings for semiconductor processing equipment Electrical insulators Silicon wafer handling and processing Substrates & insulators for microelectronic devices & opto electronic devices Substrates for electronic packages Chip carriers for sensors and detectors Chip lets Col lets Laser heat management components Molten metal fixtures Packages for microwave devices.
Product Description
Products name
Laser drilling Aluminum Nitride Ceramic AlN Plate Ceramic Sheet/parts for insulating part
Meterial
Alumina nitride
Shape
square
Color
beige
Density
3.2g/cm3
Max temperature usage
1300℃
Moulding method
Isostatic compaction
Compresive strength
3800Mpa
Electrical insolation
Yes
Acid and alkali resistant
Yes
Thermal conductivity
30W/mk
Applications
Industrial substrate

customized aluminium nitride heat dissipation ceramic substrate/ceramic sheet/ ceramic substrate for circuit board

Application: abrasion resistant lining patch; patch type electronic component substrate; computer accessories.
strong current, strong voltage, high temperature and easy wear parts of electronic appliances and mechanical equipment.

Physical properties: insulation, shock resistance, high temperature resistance, wear resistance, high strength

Specification
Some common applications of Aluminum Nitride include the following: Heat sinks & heat spreaders Electrical insulators for lasers Chucks, clamp rings for semiconductor processing equipment Electrical insulators Silicon wafer handling and processing Substrates & insulators for microelectronic devices & opto electronic devices Substrates for electronic packages Chip carriers for sensors and detectors Chip lets Col lets Laser heat management components Molten metal fixtures Packages for microwave devices
Property Content
Unit
Property Index
Density
g/cm3
≥3.30g/cm3
Water absorption
%
0
Thermal conductivity
(20 ℃,W/m.k)
≥170
Linear expansion coefficient
(RT-400℃,10-6)
4.4
Flexural strength
Mpa
≥330
Bulk resistance
Ω.cm
≥10^14
Dielectric constant
MHz
9.0
Dissipation factor
MHz
3 x 10-4
Dielectric strength
KV/mm
≥15

 

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