Aluminum Nitride Ceramic Heat Sinks

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Aluminum Nitride Ceramic Heat Sinks

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Aluminum Nitride Ceramic Heat Sinks

Aluminum Nitride (AlN) is an excellent material to use if high thermal conductivity and electrical insulation properties are required; making it an ideal material for use in thermal management and electrical applications. Additionally, AlN is a common alternative to Beryllium Oxide (BeO) in the semiconductor industry as it is not a health hazard when machined.

Aluminum Nitride has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.
Aluminum Nitride is one of the few materials that offers electrical insulation and high thermal conductivity. This makes AlN extremely useful in high power electronic applications in heat sink and heat spreader applications.
Aluminum Nitride Machining Precision Ceramics is your Aluminum Nitride machining specialist for your technical ceramic prototyping & manufacturing needs.
Aluminum Nitride can be machined in green, biscuit, or fully dense states. While in the green or biscuit form it can be machined relatively easily into complex geometries. However, the sintering process that is required to fully densify the material causes the Aluminum Nitride body to shrink approximately 20%. This shrinkage means that it is impossible to hold very tight tolerances when machining AlN pre-sintering.
In order to achieve very tight tolerances, fully sintered material must be machined/ground with diamond tools. In this process a very precise diamond coated tool/wheel is used to abrade away the material until the desired form is created. Due to the inherent toughness and hardness of the material, this can be a time consuming and costly process.
AlN commonly comes in substrates up to 1 mm thick which can easily be laser cut. It can also come in thicker forms, however, it can be difficult/costly to manufacture in small quantities if the part requires custom material or significant machining.
Aluminum Nitride (AlN) is an excellent material to use if high thermal conductivity and electrical insulation properties are required. Because of it’s qualities, it is an ideal material for use in thermal management and electrical applications.

Ceramic Heat Sink Made of Aluminum Nitride Ceramic, offers supreme thermal conductivity, electrical insulation, and lightweight, combining efficiency and sustainability in one. Applications in electronic components, telecom network communication, high power LED light or display, PCB and industrial.

Advantage of Aluminum Nitride Ceramic Heat-Sink

  • Anti oxidation at <900°C
  • Corrosion resistant
  • Waterproof
  • Electrical isolation
  • 30% lighter than Aluminium
  • Eco-friendly

Aluminum Nitride Ceramic Heat-Sinks

With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for
applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.
Advantages:
· High thermal conductivity combined with good electrical insulation characteristics.
· Exceptional stability when exposed to many molten salts.
· Thermal stability up to at least 1500°C
· Favorable mechanical characteristics extending into the high temperature range.
· Low thermal expansion and resistance to thermal shock.
· Special optical and acoustic characteristics.
Physical Properties
· Flexural strength is 300 ± 5MPa
· Coefficient of thermal expansion is 5.6×10-6K-1 (20-1000°C)
· Thermal conductivity is 70-180 W/m.K
· Insulation resistance is >1012Ωcm (20°C)

· Low Pressure Injection Molding
· Cold Isostatic Press
· Dry Press
· Tape Casting
· Precision Machining Processing
Products:
· AlN Ceramic Heat-sinks for high power system
· AlN Crucible for Metal Melting
· AlN Ceramic Rod
· AlN Ceramic Heater
· Ceramic Substrate
· Custom Shape

Aluminum Nitride Ceramic Heat Sinks

Property
Unit
Alumina Nitride Ceramic
Color
Grey
Mechanical Properties
Density
g/cm3
3.31
Compressive Strength
MPa
2100
Flexural Strength
MPa
335
Vickers Hardness 
GPa
11
Thermal Properties
Maximum Temperature
                                Oxidizing
°C
700
Inert
°C
1300
Thermal Conductivity 
30
@ 25°C
W/mK
180
@ 300°C
W/mK
130
Coefficient of Expansion
CTE 25°C ➞ 100°C
10^-6/°C
3.6
CTE 25°C ➞ 300°C
10^-6/°C
4.6
CTE 25°C ➞ 500°C
10^-6/°C
5.2
CTE 25°C ➞ 1000°C
10^-6/°C
5.6
Specific Heat
100°C
750
Thermal Shock Resistance ΔT
°C
400
Electrical Properties
Dielectric Constant
1 MHz
8.6
Dielectric Strength 
kV/mm
>15
Loss Tangent
1 MHz
5×10^-4

 

Aluminum Nitride Ceramic Heat Sinks

Aluminum Nitride Ceramics is one of the few materials that offers electrical insulation and high thermal conductivity. This makes AlN extremely useful in high power electronic applications in heat sink and heat spreader applications.

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