Aluminum Nitride Ceramic CNC Heat Sink

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Aluminum Nitride Ceramic CNC Heat Sink

Ceramic Heat Sink Made of Aluminum Nitride Ceramic, offers supreme thermal conductivity, electrical insulation, and lightweight, combining efficiency and sustainability in one. Applications in electronic components, telecom network communication, high power LED light or display, PCB and industrial.

Advantage of Aluminum Nitride Ceramic Heat-Sink

  • Anti oxidation at <900°C
  • Corrosion resistant
  • Waterproof
  • Electrical isolation
  • 30% lighter than Aluminium
  • Eco-friendly
Aluminum Nitride Ceramic CNC Heat Sink
With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for
applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.
Advantages:
· High thermal conductivity combined with good electrical insulation characteristics.
· Exceptional stability when exposed to many molten salts.
· Thermal stability up to at least 1500°C
· Favorable mechanical characteristics extending into the high temperature range.
· Low thermal expansion and resistance to thermal shock.
· Special optical and acoustic characteristics.
Physical Properties
· Flexural strength is 300 ± 5MPa
· Coefficient of thermal expansion is 5.6×10-6K-1 (20-1000°C)
· Thermal conductivity is 70-180 W/m.K
· Insulation resistance is >1012Ωcm (20°C)

· Low Pressure Injection Molding
· Cold Isostatic Press
· Dry Press
· Tape Casting
· Precision Machining Processing
Products:
· AlN Ceramic Heat-sinks for high power system
· AlN Crucible for Metal Melting
· AlN Ceramic Rod
· AlN Ceramic Heater
· Ceramic Substrate
· Custom Shape

ALUMINUM NITRIDE CERAMICS IS ONE OF THE FEW MATERIALS THAT OFFERS ELECTRICAL INSULATION AND HIGH THERMAL CONDUCTIVITY. THIS MAKES ALN EXTREMELY USEFUL IN HIGH POWER ELECTRONIC APPLICATIONS IN HEAT SINK AND HEAT SPREADER APPLICATIONS. 

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