ホットプレス窒化アルミニウムヒーターカバープレート

Hot-pressing Aluminum Nitride heater Cover Plate with thinnest thickness 0.75mm.

1.The material is very difficult to machine due to the high hardness and brittle, so it is very easily to have chips or scratches when handling or machining which lead to very high rejection rate.

2.Hot pressing aluminum nitride ceramics are sintered by vacuum hot pressing, the sintering process is more difficult than pressureless sintering. The aluminum nitride purity is up to 99.5%(without any sintering additives), and density after hot pressing reaches 3.3g/cm3, it also has excellent thermal conductivity and high electrical insulation. The thermal conductivity can be from 90 W /(m·k) に 210 W /(m·k).

3.The thinnest thickness only 0.75mm which is also difficult to machine.

The application of the Hot-pressing Aluminum Nitride heater Cover Plate：
-Cover plate heater for semiconductor
– Cover plates and MRI equipment(Magnetic Resonance Imaging)
-High-power detectors, plasma generators, military radios
-Electrostatic chucks and heating plates for semiconductors and integrated circuits
– Infrared and microwave window material

Material Features

1.均一な微細構造

2.高い熱伝導率* (70-180 Wm-1K-1), 加工条件と添加剤で調整

3.高い電気抵抗率

4.シリコンに近い熱膨張係数

5.腐食および侵食に対する耐性

6.優れた耐熱衝撃性

7.H2およびCO2雰囲気で980°Cまで化学的に安定, そして1380°Cまでの空気中で (表面酸化

780°C付近で発生; 表面層は1380°Cまでバルクを保護します).

Typical Specification: