Mainly by evaporation, magnetron sputtering and other surface deposition process to carry on the substrate surface metallization, first under the condition of vacuum sputtering, titanium, and then is copper particles, the plating thickness, then finish making line with ordinary PCB craft, and then to plating/electroless deposition way to increase the thickness of the line, the preparation of DPC way contains vacuum coating, wet deposition,Exposure development, etching and other processes.