Plaque de couverture chauffante en nitrure d'aluminium pressée à chaud

Hot-pressing Aluminum Nitride heater Cover Plate with thinnest thickness 0.75mm.

1.The material is very difficult to machine due to the high hardness and brittle, so it is very easily to have chips or scratches when handling or machining which lead to very high rejection rate.

2.Hot pressing aluminum nitride ceramics are sintered by vacuum hot pressing, the sintering process is more difficult than pressureless sintering. The aluminum nitride purity is up to 99.5%(without any sintering additives), and density after hot pressing reaches 3.3g/cm3, it also has excellent thermal conductivity and high electrical insulation. The thermal conductivity can be from 90 Avec/(Tube·Excellent physique) à 210 Avec/(Tube·Excellent physique).

3.The thinnest thickness only 0.75mm which is also difficult to machine.

The application of the Hot-pressing Aluminum Nitride heater Cover Plate：
-Cover plate heater for semiconductor
– Cover plates and MRI equipment(Magnetic Resonance Imaging)
-High-power detectors, plasma generators, military radios
-Electrostatic chucks and heating plates for semiconductors and integrated circuits
– Infrared and microwave window material

Material Features

1.Microstructure uniforme

2.Haute conductivité thermique* (70-180 Wm-1K-1), sur mesure via les conditions de traitement et les additifs

3.Haute résistivité électrique

4.Coefficient de dilatation thermique proche de celui du Silicium

5.Résistance à la corrosion et à l'érosion

6.Excellente résistance aux chocs thermiques

7.Chimiquement stable jusqu'à 980°C en atmosphères H2 et CO2, et dans l'air jusqu'à 1380°C (oxydation superficielle

se produit autour de 780°C; la couche superficielle protège le vrac jusqu'à 1380°C).

Typical Specification: