Aluminum Nitride AlN Ceramic Insulator Parts For High Power Led

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Aluminum Nitride AlN Ceramic Insulator Parts For High Power Led

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Aluminum Nitride AlN Ceramic Insulator Parts For High Power Led

Aluminum Nitride (AlN) is an excellent material to use if high thermal conductivity and electrical insulation properties are required; making it an ideal material for use in thermal management and electrical applications. Additionally, AlN is a common alternative to Beryllium Oxide (BeO) in the semiconductor industry as it is not a health hazard when machined. Aluminum Nitride has a coefficient of thermal expansion and electrical insulation properties that closely matches that of Silicon wafer material, making it an useful material for electronics applications where high temperatures and heat dissipation is often a problem.

Property
Unit
Alumina Nitride Ceramic
color
grey
Mechanical Properties
Density
g/cm3
3.31
Compressive Strength
MPa
2100
Flexural Strength
MPa
335
Vickers Hardness
GPa
11
Thermal Properties
Maximum Temperature
Oxidizing
°C
700
Inert
°C
1300
Thermal Conductivity
30
@ 25°C
W/mK
180
@ 300°C
W/mK
130
Coefficient of Expansion
CTE 25°C – 100°C
10^-6/°C
3.6
CTE 25°C – 300°C
10^-6/°C
4.6
CTE 25°C – 500°C
10^-6/°C
5.2
CTE 25°C – 1000°C
10^-6/°C
5.6
Specific Heat
100°C
750
Thermal Shock Resistance ΔT
°C
400
Electrical Properties
Dielectric Constant
1 MHz
8.6
Dielectric Strength
kV/mm
>15
Loss Tangent
1 MHz
5×10^-4
Product Description

 The Aluminum Nitride(AlN) ceramic has high thermal coductivity(5-10 times as the Alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance, and the linear expansion cofficient is similar with Si, which is widely used in communication compents, high power led, power electronic devices and other fields. Special spec products can be produced upon requests.

 

Product Features:

  1. High thermal conductivity, high flexural strength, high temperature
  2. Good electrical insulation
  3. Low dielectric constant and loss
  4. Able to be laser drilled, metallized, plated and brazed

Application:

  1. RF/Microwave components
  2. Power modulus
  3. Power transformers
  4. High power LED package
  5. Laser diode sub-mounts
  6. LED chip sub-mount
  7. Microelectronic packages
  8. Transistors

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